Polyimides [electronic resource] / by Doug Wilson, Horst D. Stenzenberger, Paul M. Hergenrother.
Erişim Adresi
ISBN
9789401096614
Dil Kodu
İngilizce
Yer Numarası
DK/7468
Yazar
Basım Bildirimi
1st ed. 1990.
Yayın Bilgisi
Dordrecht : Springer Netherlands : Imprint: Springer, 1990.
Fiziksel Niteleme
X, 297 p. 9 illus. online resource.
İçindekiler Notu
1 Synthesis of aromatic polyimides from dianhydrides and diamines -- 2 Other synthetic routes to polyimides -- 3 Structure-property relationships in linear aromatic polyimides -- 4 Chemistry and properties of addition polyimides -- 5 Characterisation of polyimides -- 6 Polyimides as adhesives -- 7 Polyimides as resin matrices for advanced composites -- 8 Polyimides for semiconductor applications -- 9 Films, mouldings and other applications -- Appendix: Commercially available polyimides.
Özet, vb.
The last twenty years or so have seen a flurry of activity in the synthesis of new polymer systems. This interest has developed largely as a result of the increased need for advanced materials. Despite the emergence of a number of outstanding polymers, it is the polyimides that have captured the imagination of scientists and engineers alike as materials that offer outstanding promise for the high technology applic ations of the future. The reputation of the polyimide has been established on the bases of outstanding thermal stability, excellent mechanical properties and the ability to be fabricated into useful articles. Polyimides offer a versatility unparalleled in most other classes of macromolecules. Polymers can be prepared from a variety of starting materials, by a variety of synthetic routes. They can be tailor-made to suit specific applications. By judicious choice of starting materials, polymers can be made that offer variations in such properties as glass transition tempera ture, oxidative stability, toughness, adhesion, and permeability. It is this versatility that has led to the use of polyimides in a wide variety of applications. The electronics industry makes extensive use of poly imide films in, ior example, semiconductor applications. The leading polymer matrices for high temperature advanced composites are polyimides. High temperature adhesive systems for the bonding of metals or composites are often based on polyimides. In addition, polyimides are now finding use as fibres, foams, sealents and even membranes for the low energy separation of industrial gases.
Konu
Social sciences.
Humanities.
Humanities and Social Sciences.
Humanities.
Humanities and Social Sciences.
Diğer Yazarlar
Kurum Adı
Eseri Alıntıla
Referansları kullanmadan önce gözden geçirmeniz ve varsa gerekli düzeltmeleri yapmanız önerilir.
Dijital Kaynak
MARC Görünümü
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245 10|aPolyimides|h[electronic resource] /|cby Doug Wilson, Horst D. Stenzenberger, Paul M. Hergenrother.
250 |a1st ed. 1990.
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505 0 |a1 Synthesis of aromatic polyimides from dianhydrides and diamines -- 2 Other synthetic routes to polyimides -- 3 Structure-property relationships in linear aromatic polyimides -- 4 Chemistry and properties of addition polyimides -- 5 Characterisation of polyimides -- 6 Polyimides as adhesives -- 7 Polyimides as resin matrices for advanced composites -- 8 Polyimides for semiconductor applications -- 9 Films, mouldings and other applications -- Appendix: Commercially available polyimides.
520 |aThe last twenty years or so have seen a flurry of activity in the synthesis of new polymer systems. This interest has developed largely as a result of the increased need for advanced materials. Despite the emergence of a number of outstanding polymers, it is the polyimides that have captured the imagination of scientists and engineers alike as materials that offer outstanding promise for the high technology applic ations of the future. The reputation of the polyimide has been established on the bases of outstanding thermal stability, excellent mechanical properties and the ability to be fabricated into useful articles. Polyimides offer a versatility unparalleled in most other classes of macromolecules. Polymers can be prepared from a variety of starting materials, by a variety of synthetic routes. They can be tailor-made to suit specific applications. By judicious choice of starting materials, polymers can be made that offer variations in such properties as glass transition tempera ture, oxidative stability, toughness, adhesion, and permeability. It is this versatility that has led to the use of polyimides in a wide variety of applications. The electronics industry makes extensive use of poly imide films in, ior example, semiconductor applications. The leading polymer matrices for high temperature advanced composites are polyimides. High temperature adhesive systems for the bonding of metals or composites are often based on polyimides. In addition, polyimides are now finding use as fibres, foams, sealents and even membranes for the low energy separation of industrial gases.
532 8 |aAccessibility summary: This PDF is not accessible. It is based on scanned pages and does not support features such as screen reader compatibility or described non-text content (images, graphs etc). However, it likely supports searchable and selectable text based on OCR (Optical Character Recognition). Users with accessibility needs may not be able to use this content effectively. Please contact us at accessibilitysupport@springernature.com if you require assistance or an alternative format.
532 8 |aInaccessible, or known limited accessibility
532 8 |aNo reading system accessibility options actively disabled
532 8 |aPublisher contact for further accessibility information: accessibilitysupport@springernature.com
650 0|aSocial sciences.
650 0|aHumanities.
650 14|aHumanities and Social Sciences.
700 1 |aStenzenberger, Horst D.|eauthor.|4aut|4http://id.loc.gov/vocabulary/relators/aut
700 1 |aHergenrother, Paul M.|eauthor.|4aut|4http://id.loc.gov/vocabulary/relators/aut
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020 |a9789401096614|9978-94-010-9661-4
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041 |aeng
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100 1 |aWilson, Doug.|eauthor.|4aut|4http://id.loc.gov/vocabulary/relators/aut
245 10|aPolyimides|h[electronic resource] /|cby Doug Wilson, Horst D. Stenzenberger, Paul M. Hergenrother.
250 |a1st ed. 1990.
264 1|aDordrecht :|bSpringer Netherlands :|bImprint: Springer,|c1990.
300 |aX, 297 p. 9 illus.|bonline resource.
336 |atext|btxt|2rdacontent
337 |acomputer|bc|2rdamedia
338 |aonline resource|bcr|2rdacarrier
347 |atext file|bPDF|2rda
505 0 |a1 Synthesis of aromatic polyimides from dianhydrides and diamines -- 2 Other synthetic routes to polyimides -- 3 Structure-property relationships in linear aromatic polyimides -- 4 Chemistry and properties of addition polyimides -- 5 Characterisation of polyimides -- 6 Polyimides as adhesives -- 7 Polyimides as resin matrices for advanced composites -- 8 Polyimides for semiconductor applications -- 9 Films, mouldings and other applications -- Appendix: Commercially available polyimides.
520 |aThe last twenty years or so have seen a flurry of activity in the synthesis of new polymer systems. This interest has developed largely as a result of the increased need for advanced materials. Despite the emergence of a number of outstanding polymers, it is the polyimides that have captured the imagination of scientists and engineers alike as materials that offer outstanding promise for the high technology applic ations of the future. The reputation of the polyimide has been established on the bases of outstanding thermal stability, excellent mechanical properties and the ability to be fabricated into useful articles. Polyimides offer a versatility unparalleled in most other classes of macromolecules. Polymers can be prepared from a variety of starting materials, by a variety of synthetic routes. They can be tailor-made to suit specific applications. By judicious choice of starting materials, polymers can be made that offer variations in such properties as glass transition tempera ture, oxidative stability, toughness, adhesion, and permeability. It is this versatility that has led to the use of polyimides in a wide variety of applications. The electronics industry makes extensive use of poly imide films in, ior example, semiconductor applications. The leading polymer matrices for high temperature advanced composites are polyimides. High temperature adhesive systems for the bonding of metals or composites are often based on polyimides. In addition, polyimides are now finding use as fibres, foams, sealents and even membranes for the low energy separation of industrial gases.
532 8 |aAccessibility summary: This PDF is not accessible. It is based on scanned pages and does not support features such as screen reader compatibility or described non-text content (images, graphs etc). However, it likely supports searchable and selectable text based on OCR (Optical Character Recognition). Users with accessibility needs may not be able to use this content effectively. Please contact us at accessibilitysupport@springernature.com if you require assistance or an alternative format.
532 8 |aInaccessible, or known limited accessibility
532 8 |aNo reading system accessibility options actively disabled
532 8 |aPublisher contact for further accessibility information: accessibilitysupport@springernature.com
650 0|aSocial sciences.
650 0|aHumanities.
650 14|aHumanities and Social Sciences.
700 1 |aStenzenberger, Horst D.|eauthor.|4aut|4http://id.loc.gov/vocabulary/relators/aut
700 1 |aHergenrother, Paul M.|eauthor.|4aut|4http://id.loc.gov/vocabulary/relators/aut
710 2 |aSpringerLink (Online service)
773 0 |tSpringer Nature eBook
776 08|iPrinted edition:|z9780216926806
776 08|iPrinted edition:|z9789401096621
776 08|iPrinted edition:|z9789401096638
856 40|uhttps://doi.org/10.1007/978-94-010-9661-4
912 |aZDB-2-SHU
912 |aZDB-2-SXH
912 |aZDB-2-BAE
950 |aHumanities, Social Sciences and Law (SpringerNature-11648)
950 |aHistory (R0) (SpringerNature-43722)
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