Surface Mount Technology [electronic resource] : Principles and Practice / by Ray P. Prasad.

Erişim Adresi
Link
ISBN
9789401165327
Dil Kodu
İngilizce
Yer Numarası
DK/14218
Yazar
Prasad, Ray P.
Basım Bildirimi
1st ed. 1989.
Yayın Bilgisi
Dordrecht : Springer Netherlands : Imprint: Springer, 1989.
Fiziksel Niteleme
XXIV, 610 p. online resource.
İçindekiler Notu
One Introduction to Surface Mounting -- 1 Introduction to Surface Mounting -- 2 Implementing Surface Mount Technology -- Two Designing with Surface Mounting -- 3 Surface Mount Components -- 4 Substrates for Surface Mounting -- 5 Surface Mount Design Considerations -- 6 Surface Mount Land Pattern Design -- 7 Design for Manufacturability, Testing, and Repair -- Three Manufacturing with Surface Mounting -- 8 Adhesive and Its Application -- 9 Solder Paste and Its Application -- 10 Metallurgy of Soldering and Solderability -- 11 Component Placement -- 12 Soldering of Surface Mounted Components -- 13 Flux and Cleaning -- 14 Quality Control, Repair, and Testing -- Appendix A Surface Mount Standards -- Appendix B Detailed Questionnaire for Evaluating Pick-and-Place Equipment for Surface Mounting -- Appendix C Glossary.
Özet, vb.
Surface Mount Technology is not a technology of tommorrow but a technology of today. It provides a quantum jump in the packaging tech­ nology to produce state-of-the-art miniaturized electronic products. How­ ever, in order to take advantage of this technology, a complete infrastruc­ ture must be put in place. This requires considerable investment in human and capital resources. Intel corporation has made these investments to keep its customers for components and systems on the leading edge of technology. Based on the experience of putting this infrastructure in place for system products, this book is written for managers who need to manage the risk during its implementation, and the practicing engineers who need to improve the design and manufacturing processes for improved yield and cost reduction. To accomplish this task, I have not only culled the infor­ mation from published materials, but have also depended on input from both my colleagues in Intel and such outside organizations as the Institute of interconnecting and Packaging electronic Circuits (IPC) , the Electronics Industries Association (EIA), and the Surface Mount Council. But the underlying basis for this book has been my first-hand experience in im­ plementing this technology for Intel Systems Group and my experience at Boeing, my previous employer. In a fast-changing technology like SMT, it is very easy to have obsolete information even before the book is published. For this reason, I have concentrated on the basic principles and practice of the technology.
Konu
Social sciences.
Humanities.
Humanities and Social Sciences.
Kurum Adı
SpringerLink (Online service)
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